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Aurornis 5 hours ago

Hardcore builders will remove the lid of their CPU to get the best possible thermal contact. The performance improvement is very small and not worth it but the bragging rights are fun. Unless you destroy the chip while delidding it, that is.

srean 2 hours ago | parent | next [-]

Your comment reminded me of my K6 (or was it a K7) based PC I had assembled as a high schooler of modest means.

My goto testing protocol was to recompile the Linux kernel and make GNU chess play itself at the highest settings.

I was quite disheartened to find that my rig would crash out repeatedly. Not a single successful compilation of the kernel. Then on a whim I removed the case and pointed my table fan at it. Voila, everything worked.

I had planned to get some more thermal paste and redo the thermals and put the case back. But I never did.

Then one day the dialer of my landline got fried by a thunderstorm. No problem I used to dial using my modem and my skeletonic linux box.

Great setup when the money is tight. Good times.

joaquincabezas an hour ago | parent [-]

Table fan was the way to go in our first LAN party during the summer of the year 2000 in the south of Spain. These computer case side panels were all piled against the wall.

jdiff 5 hours ago | parent | prev | next [-]

The article mentions this, but this was before CPUs had lids. When delidding a CPU, you have to be very careful not to crack the silicon die that you are applying force directly to. In the case of this Athlon, even care wasn't enough.

polpo 5 hours ago | parent [-]

Interestingly, AMD's previous gen processors, the K6/K6-2/K6-III, were all lidded flip chips. A delidded K6-era CPU looks remarkably similar to the early Athlons which did away with the lid.

3453f4f 5 hours ago | parent [-]

There are three good pieces of history for you to look at.

First, the NexGen Nx686 prototype... that became the K6 after AMD bought NexGen.

https://web.archive.org/web/19990901212245/http://www.sandpi...

https://web.archive.org/web/20000831030211/http://www.sandpi...

https://web.archive.org/web/20000831030227/http://www.sandpi...

Second, the AMD K6 prototype... which came in a small footprint ceramic package.

https://www.cpushack.com/chippics/AMD/K6/AMDK6-Processor-CA-...

Third, the AMD K7... which also came in that small footprint ceramic package, on a Slot A PCB, with L2 cache chips.

http://www.cpu-galerie.de/html/amdk7athlonslot.html

Enjoy!

srean 2 hours ago | parent [-]

https://news.ycombinator.com/item?id=49407748

Thanks for the nostalgia trip.

xattt 4 hours ago | parent | prev [-]

Flip-chip packaging is still common in laptops. Still a (albeit minor) risk if you're repasting an older laptop.

formerly_proven 3 hours ago | parent | next [-]

The article is mistaken, all the lidded chips (discussed here) are also flip chip/C4. Just with a metal plate on top. That would be in contrast to the earlier lidded chips (like a 68k or i486) with ceramic packages, where the chip is mounted right side up on the ceramic package and then wire bonded, the lid just covers the bond wires.

weiran 3 hours ago | parent | prev [-]

TBH I don’t think I’ve seen a lidded chip on anything other than a CPU.

NuclearPM 2 hours ago | parent [-]

Thank you for being honest.