Flip-chip packaging is still common in laptops. Still a (albeit minor) risk if you're repasting an older laptop.

The article is mistaken, all the lidded chips (discussed here) are also flip chip/C4. Just with a metal plate on top. That would be in contrast to the earlier lidded chips (like a 68k or i486) with ceramic packages, where the chip is mounted right side up on the ceramic package and then wire bonded, the lid just covers the bond wires.

TBH I don’t think I’ve seen a lidded chip on anything other than a CPU.