Below is some additional detail about the processor. Like the parent comment notes, ARM licenses IP of an ISA or core designs (see ARM C1-Ultra cores [0]), licensees like Qualcomm then make specific SoC for different use-cases.

  Xiaomi has made the XRING 03 boast a larger die size than the XRING 01, 
  measuring 133mm² compared to its predecessor’s 109mm² dimensions This change 
  was deemed necessary as the flagship SoC features 16MB of SLC cache, not to 
  mention a new “6 + 4” CPU cluster that comprises two ARM C1-Ultra cores 
  running at 4.35GHz, four C1-Premium cores operating at 3.68GHz and lastly, 
  four C1-Pro cores running at 3.15GHz. [1]

1. https://wccftech.com/xiaomi-xring-03-official-tsmc-3nm-n3p-l...