Demand crunch comes from the customer. All HBM and DDR5 wafer capacity is sold out through 2027 and all three vendors are booking 2028 capacity.

This was not created by the manufacturers.

The manufacturers are not doing a whole lot to fix the problem l and I don’t blame them. It’s expensive to build out and they know demand will slow down and don’t want to be stuck with excess capacity. Better to be sold out and high prices.

Samsung said they were “moderating demand” which doesn’t sound like they want this problem to be solved either.