The article mentions, but doesn't explicitly state, that they're going to be using electron beam lithography. Makes sense for their low volume and/or prototype fab goal, but I'm curious how well that would work for prototyping to fab at high volume with the likes of TSMC or Intel.

I would assume that re-targeting a design to a different fab's process would change enough about it that you might as well just do verification in simulation rather than sidetrack through Fab2.

I think this might make a lot of sense in modern warfare scenarios: We're seeing in Ukraine that being able to produce weapons such as drones in very small production facilities using 3D printers and 'simple' technology makes it very hard for an adversary to shut down said production.

The more components can be produced in such a way, the better. Chips currently are quite an exception to that.