Sure it does. If it’s many small dies on a wafer, then imperfections don’t ruin the entire batch; you just bin those components. If the entire wafer is a single die, you have much less tolerance for errors.

Although, IIUC, Cerebras expects some amount of imperfection and can adjust the hardware (or maybe the software) to avoid those components after they're detected. https://www.cerebras.ai/blog/100x-defect-tolerance-how-cereb...

You can just do dynamic binning.