Nowhere close, but pace now seems faster than estimated, i.e. original western estimate is they won't even get EUV prototype up until 2030s.

Right now their chips are already "economically" competitive, as in SMIC is starving on 20% margins vs ASML/TSMC/NVIDIA getting gluttonous on 50-70%, at least for enterprise AI. Current scarcity pricing = litho costs borderline rounding error, 1500 Nvidia chip flips for 30000, 6000 huawei chip flips for 20000. The problem is really # of tools access and throughput. They can only bring in so many expensive ASML machines, including smuggling, which caps how much wafers they can afford to toss at low yield. They figure out domestic DUV to 2000 series and throughput is solved.

Hence IMO people sleeping on Huawei 9030 on 5nm DUV SAQP, still using ASML DUV for high overlay requirement processes, domestic DUV to fill rest. But once they figure out SAQP overlay, which will come before EUV, they're "set". For cost a 300m-400m ASML EUV, PRC can brrrt tools at BOM / cost plus margin. Think 40 domestic DUVs and associated infra for price of one ASML EUV to run 8x lines with 30% yield and still build 2x more chips normalized for compute that they can run on cheap local energy to match operating costs. Then they have export shenanigans like bundle 5nm chips with renewable energy projects and all of sudden PRC data center + energy combo deals might be globally competitive with 3/2nm. Deal with our shitter chips for now, once they deprecate we give you something better when our processes narrows gap, and you have bonus power to boot because some jurisdictions, building grid is harder than building fabs.

How does one even smuggle an ASML machine? I'd assume the machine stops working if the GPS position doesn't compute, at end of life I wouldn't expect ASML to allow these devices nor their components to end up on the second hand market, I'd expect the future transfers to require continued permission of ASML, much like weapons distribution.