Sure - once you have dozens of engineers and 5 years under your belt you'll be good to go!

This will get you started: https://youtu.be/B2482h_TNwg

Keep in mind that every wafer makes multiple trips around the fab, and on each trip it visits multiple machines. Broadly, one trip lays down one layer, and you may need 80-100 layers (although I guess DRAM will be fewer). Each layer must be aligned to nanometer precision with previous layers, otherwise the wafer is junk.

Then as others have said, once you finish the wafer, you still need to slice it, test the dies, and then package them.

Plus all the other stuff....

You'll need billions in investment, not millions - good luck!