Do TSMC current node sizes allow for Backside Power Delivery (BPD)?

As someone who knows nothing about PCB, from those images it appears that double side printing of some sort is happening.

Please correct me if I'm wrong.

No backside power delivery on TSMC yet, even at 2nm. It's supposed to come on TSMC's A16 node.

I think what you're seeing is the silicon layers visible from the back through the bulk substrate, and the metal layers on the front.

There is no backside anything here. This may be a photo of a thinned die; silicon is somewhat transparent so you can often see the die structures better from the back because it isn't blocked by the metal stack.