I really like the principles behind AMD's chiplet design, of course they've had different design goals behind it (easier diversification of their product portfolio), but it remains a fact that you can slap a not-so-terrible GPU right next to a CPU core.

There's probably a lot still missing: Apple integrated the memory on the same die, and built Metal for software to directly take advantage of that design. That's the competitive advantage of vertical integration.

> Apple integrated the memory on the same die

It's on the same package but not the same die