| ▲ | magicalhippo 2 days ago | |
The paper[1] has some actual details, like this: Under low-heat-pumping, with minimal role of parasitics, TFTEC modules offer four times the Coefficient of Performance (CoP) advantage over bulk devices. As an example, system-level CoP with a 16-couple TFTEC module is ~ 15 for small temperature differentials of 2 °C, pumping about 1.2 W heat load using 80 mW of electric power. Such small-scale high-CoP cooling is relevant for distributed refrigeration or compartmentalized refrigeration as well as for use in future electronic thermal management They also note that the maximum cooling power density depends inversely on thickness, and this is where the thin-film TECs like this gets most of their improvements from, compared to millimeter thick regular TECs. Just a quick scan before going to bed, but looks interesting for certain applications. | ||